Description: Master Bond EP41S-F is a two-part epoxy for bonding, sealing, coating, and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance and ...

Description: Master Bond EP17HT-100 is a single-part epoxy system that is designed to cure in 60-90 minutes at 200°-220°F. Cures can be accelerated at higher temperatures. This low-heat curing ...

High temperature resistant two component epoxy system EP62-1 cures rapidly at moderately elevated temperatures. Working life after mixing a 100 gram batch is > 12 hours at 75°F. Typical cures ...

High performance epoxy adhesive system EP22 has a convenient one to one mix ratio and cures at room temperature. It has excellent bond strength to similar and dissimilar substrates, good void filling ...

Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds, formulated to meet the rigorous needs of the electronics industry. Master Bond’s wide ...

HACKENSACK, N.J.—Master Bond Inc. has released a new single component epoxy designed for glob top and chip coating applications. The firm said in a news release that Supreme 3CCM-85 also can be used ...

Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest thermal conductivity ...

Master Bond EP39MHT is a two component, epoxy system for high performance bonding, sealing, coating, potting and encapsulation. This epoxy is an excellent adhesive and bonds well to a wide variety of ...

Low viscosity Fast curing, even in thin sections Good sterilization resistance Passes ISO 10993-5 Master Bond EP30-4Med is an optically clear, two component epoxy system for high performance bonding, ...